发明名称 Adjustable dosing algorithm for control of a copper electroplating bath
摘要 A method and apparatus for supplying a dose to an electrolyte solution including measuring the time after adding fresh solution, measuring the Amp-hours after adding fresh solution, measuring the number of substrates processed by the solution, calculating the volume of a dose to supply to the solution based on the time, Amp-hours, and number of substrates processed, and adding the dose to the solution.
申请公布号 US2007089990(A1) 申请公布日期 2007.04.26
申请号 US20050255855 申请日期 2005.10.20
申请人 BEHNKE JOSEPH F;WEBB TIMOTHY R;RABINOVICH YEVGENIY;ZHENG BO;FISCHENICH THOMAS J 发明人 BEHNKE JOSEPH F.;WEBB TIMOTHY R.;RABINOVICH YEVGENIY;ZHENG BO;FISCHENICH THOMAS J.
分类号 C25D21/18 主分类号 C25D21/18
代理机构 代理人
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