Substrate placing mechanism

摘要

The present invention is a substrate placing mechanism including: a placing stage provided for placing a substrate to be processed thereon in a processing container in which a processing atmosphere is formed by a process gas, the placing stage having a plurality of pin-inserting holes; a plurality of lifter-pins, each of which is inserted into and vertically movable in each of the plurality of pin-inserting holes; an elevating member that supports the plurality of lifter-pins; and an elevating mechanism that causes the lifter-pins to vertically move via the elevating member. Each of the plurality of pin-inserting holes has a circular protrusion at an opening part of a lower end thereof. The circular protrusion protrudes inwardly and circularly. Each of the plurality of lifter-pins has a diameter-increasing part configured to be supported by the circular protrusion to close the opening part when a corresponding lifter-pin is caused to move down.