| 摘要 |
The present invention relates to a multi-chip package structure, which comprises a first substrate, a first chip, a sub-package structure, a plurality of first solder balls, and a first molding compound. The first substrate has a first surface and a second surface. The first chip is electrically connected to the first surface of the first substrate. The sub-package structure comprises a second substrate, a second chip, and a second molding compound. The first solder balls are disposed between the first substrate and the second substrate and are used for connecting the first surface of the first substrate and the second surface of the second substrate so as to omit a step of wire bonding.
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