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发明名称
METAL DUPLEX AND METHOD
摘要
Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit tin and tin alloy surface oxidation and improve solderability of the substrates.
申请公布号
SG131043(A1)
申请公布日期
2007.04.26
申请号
SG20060061410
申请日期
2006.09.06
申请人
ROHM AND HAAS ELECTRONIC MATERIALS LLC
发明人
LAU DANNY;KWOK RAYMUND W. M.
分类号
主分类号
代理机构
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