| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a curable composition which not only has high sensitivity but is excellent in adhesion to substrates and thermal stability of the adhesion, especially a curable composition having such high curability and excellent mechanical properties that it is suitable for use as a solder resist or in direct drawing with a laser light. <P>SOLUTION: The curable composition is capable of forming a cured object which satisfies that, in a loading-unloading test with a microhardness tester, (1) a total deformation amount is ≥1.35 μm and/or (2) a load N under a displacement in loading of 0.25 μm is ≤0.50 gf, and which satisfies that, in the test, (3) a resilient restoration rate is ≥50% and/or (4) a recovery rate is ≥80%. The curable composition is capable of forming a cured object which has a cross-sectional area of the base of ≤25 μm<SP>2</SP>and satisfies that, in a loading-unloading test with a microhardness tester, (5) a resilient restoration rate is ≥50% and/or (6) a recovery rate is ≥85%. <P>COPYRIGHT: (C)2007,JPO&INPIT |
