发明名称 MATERIAL FOR FORMING UPPER LAYER FILM OF PHOTORESIST
摘要 <P>PROBLEM TO BE SOLVED: To provide a material for forming an upper layer film of a photoresist suitably applied to formation of an upper layer anti-reflection coating film superior in the low refractive index, transparency, application uniformity, and so forth having no harmful effect on the human body and safe without using fluorine-based surfactant such as PFOS and to formation of a protective film capable of suppressing influence of liquid immersion exposure liquid on a photoresist film in a liquid immersion exposure method and suppressing influence of eluted component from the photoresist film on the liquid immersion exposure liquid itself. <P>SOLUTION: The material for forming the upper layer film of the photoresist includes a fluorine-containing polymer having a structural unit represented by formula (I), and is used by being laminated on a photoresist layer on a substrate, where Q is a carboxyl group, hydroxyl group, (A) represents an alkylene group with carbon number of 1-5 or nonexistence, m is a repeating unit, and n is an integer of 1-5. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007108463(A) 申请公布日期 2007.04.26
申请号 JP20050299738 申请日期 2005.10.14
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TAKASU RYOICHI;WAKIYA KAZUMASA;KOSHIYAMA ATSUSHI
分类号 G03F7/11;C08F16/26;H01L21/027 主分类号 G03F7/11
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