| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer apparatus and a transfer method in an inspection process which do not require the replacement of change kits and is capable of reducing handling offsets. SOLUTION: The transfer apparatus 100 is used in an inspection process for mounting an IC package P to be inspected to a contact part 11 and inspecting its electrical characteristics. A transfer means 17 comprises both a transfer unit 15 and an XY transfer arm 17a. The transfer unit 15 comprises a suction nozzle for drawing an object to be inspected by suction; a rotation mechanism for rotating the suction nozzle on its axis; and an imaging means for imaging the object to be inspected mounted to a change kit or the contact part 11. In this case, the imaging means is connected to an image processing means which recognizes the handling offset between a target location of the object to be inspected mounted by handling and the actual location of the mounted object to be inspected. COPYRIGHT: (C)2007,JPO&INPIT
|
