| 摘要 |
PROBLEM TO BE SOLVED: To provide copper or copper-alloy foil by which smooth surface can be obtained when half etching is applied. SOLUTION: The copper or copper-alloy foil is characterized in that, when a cross section perpendicular to a sheet thickness direction is observed, grain size and the diameter of structures having the same orientation are made to≤5μm at the maximum, respectively. COPYRIGHT: (C)2007,JPO&INPIT
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