| 摘要 |
The interposer comprises a base 8 formed of a plurality of resin layers 68, 20, 32, 48 ; thin-film capacitors 18 a , 18 b buried between a first resin layer 68 of said plurality of resin layers and a second resin layer 20 of said plurality of resin layers, which include first capacitor electrodes 12 a , 12 b, second capacitor electrodes 16 opposed to the first capacitor electrode 12 a , 12 b and the second capacitor electrode 16 , and a capacitor dielectric film 14 of a relative dielectric constant of 200 or above formed between the first capacitor electrode 12 a , 12 b and the second capacitor electrode 16 ; a first through-electrode 77 a formed through the base 8 and electrically connected to the first capacitor electrode 12 a , 12 b; and a second through-electrode 77 b formed through the base 8 and electrically connected to the second capacitor electrode 16.
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