| 摘要 |
Inkjet printed wire-bonds, an encapsulant, and shielding are provided to protect wire-bonds by using an encapsulant. A connection method includes a process for connecting a chip to a package(210) in a semiconductor device(200). The connection method further includes a process for printing an encapsulant to a predetermined thickness on at least a part of the chip and package, a process for printing a layer of conductive material on the encapsulant in a predetermined pattern between the chip and package. The printed conductive material conforms to an upper surface of the encapsulant for defining a distance from the printed conductive material to the chip and package. The connection method further includes a process for printing a second layer(270) of encapsulant on the printed conductive material and a process for curing at least the second layer of encapsulant. |
