SUBSTRATE AND ILLUMINATING APPARATUS

摘要

Provided is a substrate by which heat generated by a semiconductor light emitting element can be dissipated and temperature increase can be suppressed. An illuminating apparatus is also provided. On the front surface of a substrate (1), many chip LEDs can be surface-mounted, and mounting regions for the chip LEDs are arranged at intervals of a prescribed size. The area of the mounting region is equivalent to an area to be occupied by the chip LED on the substrate (1). On the rear surface of the substrate (1), a plurality of heat conductive films (3 and so on) are arranged at the intervals of the prescribed size, for dissipating heat generated by the chip LEDs to the external of the substrate (1). The area of the heat conductive film (3) is larger than that of the mounting region, and is arranged to include the range of the mounting region. The heat conductive films (3 and so on) can be formed, for instance, by patterning a copper foil formed on the entire rear surface of the substrate (1).