发明名称 ATMOSPHERIC PRESSURE PLASMA TREATMENT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an atmospheric pressure plasma treatment device capable of uniformizing the concentration of plasma gas flowing on a work surface while suppressing the flow rate of process gas. <P>SOLUTION: The atmospheric pressure plasma treatment device 1, in which a parallel flat plate discharge space 8 is constituted between an upper cover 2 on an upper electrode 6 side and a table 4 on a lower electrode side on which a work W is placed, and plasma treatment is applied to the surface of the work W while process gas flows through the discharge space 8, includes an inflow gas straightening means 9 connected to the inflow end of the discharge space 8 and straightening inflow plasma gas to become uniform flow rate in the width direction and an outflow gas straightening means 10 connected to the outflow end of the discharge space 8 and straightening outflow plasma gas to become uniform flow rate in the width direction. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007109478(A) 申请公布日期 2007.04.26
申请号 JP20050297789 申请日期 2005.10.12
申请人 SEIKO EPSON CORP 发明人 MIYANO HIROYUKI
分类号 H05H1/24;H01L21/3065 主分类号 H05H1/24
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