| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin multilayer wiring board improved in high speed transmission characteristics and high frequency characteristics in a multilayer wiring board on which semiconductor elements are mounted, and also to provide a semiconductor device and its manufacturing method. <P>SOLUTION: The multilayer wiring board includes electrodes provided on a first surface and a second surface, with wiring layers and insulating layers alternately laminated and electrically connected by a via provided in the insulating layer. In the board, a second electrode 15 provided on the second surface is embedded in the insulating layer 11a, and there is formed no layer to improve adhesiveness to the insulating layer on the second wiring layer 13 covered with the insulating layers 11a, 11b, 11c. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
