| 摘要 |
PROBLEM TO BE SOLVED: To coat flux evenly in a predetermined thickness on an electronic component by a relatively simple process. SOLUTION: In a flux chamber 20, a slit 24 for forming a flux film is formed in a wall in the advancing direction (left side in Figure) of a flux belt 4 at the time of forming a flux film. At the time of forming a flux film, a flux 35 is fed out through the slit 24 by the running of the flux belt 4. In the wall of the flux chamber 20 on the opposite side from the advancing direction (right side in Figure), there is an opening 28 for collecting flux which is larger in both height and width than the slit for forming the flux film and collects the flux by the running of the flux belt 4. COPYRIGHT: (C)2007,JPO&INPIT |
