| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit module which is downsized with a minimized increase in cost in a simple structure. SOLUTION: A single-sided board is used as a mounting substrate 1, and large components are mounted there for a primary side (strong electric region) or the like such as a power module 4 having a heat dissipation board 3 attached, and a capacitor 5 for a power source. In addition, a double-sided board is used as a mounting substrate 2, where small electronic parts 6 are mounted such as an IC and a chip capacitor. Ribs 8 for mounting the substrate are formed at the center and both ends on the bottom of a tray-like circuit case 7. The mounting substrates 1 and 2 are placed side by side via the rib 8 at the center, and fixed with their respective edges mounted on the corresponding ribs 8. Further, the placed respective mounting substrates are covered with a mold potting agent 9 for the purpose of waterproofing. COPYRIGHT: (C)2007,JPO&INPIT
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