| 摘要 |
The present invention relates to an integrated chip device in a package, including an integrated chip, a substrate comprising a redistribution wiring, a contact element and a contact pad on a common surface of the substrate, wherein the contact element is in electrical contact with the contact pad, wherein the substrate is divided in at least two parts each of which is securely attached to a respective portion of the chip to form the device, wherein between at least two of the parts of the substrate a gap is provided to accommodate a thermal expansion of at least one of the parts of the substrate, a bond wire which is provided to connect the contact pad and the further contact pad of the substrate with the integrated chip through the gap.
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