发明名称 |
Method of making a circuitized substrate having a plurality of solder connection sites thereon |
摘要 |
A method of making a circuitized substrate in which solder material (e.g., in paste form) is deposited through a screen onto individual conductors in a spaced pattern of individual solder "islands". A solder flux is then deposited onto the "islands" causing these to spread out and form a continuous solder layer across the conductor's upper surface. The solder layer is then capable of coupling to an external conductor such as a solder ball, to form an electrical assembly such as might be used within an information handling system such as a personal computer.
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申请公布号 |
US2007090170(A1) |
申请公布日期 |
2007.04.26 |
申请号 |
US20050253659 |
申请日期 |
2005.10.20 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
ANDERSON STEVEN W.;MOORE SCOTT P.;PALOMAKI CHERYL L.;TRAN SON K. |
分类号 |
B23K31/02;B23K1/08;B23K31/00 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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