MEASURING DEVICE

摘要

[PROBLEMS] To provide a measuring device preferable to improve the capability of picking up each chip cut from a plate member. [MEANS FOR SOLVING PROBLEMS] A semiconductor wafer (4), an object to be measured, is supported by a support (H) composed of a ring frame (2) having an opening to which an adhesive sheet (3) is adhered. The semiconductor wafer is produced by cutting into chip-like plate member. An image processing unit (5) measures the chip intervals G and a shift angle ?. The measurement data D is sent from the image processing unit (5) to a host computer (6) and stored in storage means (12) of the host computer (6). According to the chip intervals G and the shift angle ? store in the storage means (12), a position recognition when the position of a chip is confirmed with a recognition unit of a pick-up device, for example, a camera, and correction of aligning the position of a collect for pick-up with the recognized position can be carried out at the next step.