发明名称 |
Verfahren zum Herstellen von elektronischen Elementen |
摘要 |
<p>The manufacturing method uses a semiconductor wafer with active regions (2) for the electronic elements (1) formed in its front surface, together with spaced separation regions, for dividing the electronic components from one another. A conductive contact layer (7) applied to the front surface is structured to provide contact terminals (9) across at least part of the cross-section of the separation regions, before etching the rear surface of the semiconductor wafer at the separation regions, for separating the contact terminals associated with the different electronic elements.</p> |
申请公布号 |
DE59813943(D1) |
申请公布日期 |
2007.04.26 |
申请号 |
DE1998513943 |
申请日期 |
1998.02.14 |
申请人 |
MICRONAS GMBH |
发明人 |
IGEL, GUENTER DIPL.-ING.;MALL, MARTIN DR. DIPL.-PH |
分类号 |
H01L21/60;H01L21/301;H01L21/304;H01L23/485 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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