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发明名称
METHOD DUPLEX AND METHOD
摘要
Methods and articles are disclosed. The methods are directed to depositing nickel duplex layers on substrates to inhibit corrosion and improve solderability of the substrates. The substrates have a gold or gold alloy finish.
申请公布号
SG131046(A1)
申请公布日期
2007.04.26
申请号
SG20060061469
申请日期
2006.09.06
申请人
ROHM AND HAAS ELECTRONIC MATERIALS LLC
发明人
LAU DANNY;KWOK RAYMUND W. M.
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