| 摘要 |
PROBLEM TO BE SOLVED: To provide a phenolic polymer which is useful as a curing agent in epoxy resin-based semiconductor sealants and has flame retardancy, quick curability and low melt viscosity, to provide a method for producing the same, and to provide a use thereof. SOLUTION: This phenolic polymer is obtained by reacting a phenolic compound, a bismethylbiphenyl compound, and an aromatic aldehyde in conditions that a molar ratio of the total amount of the bismethylbiphenyl compound and the aromatic aldehyde to the phenolic compound is 0.10 to 0.60 and an aromatic aldehyde/bismethylbiphenyl compound (molar ratio) is 5/95 to 50/50, and an epoxy resin composition comprises the phenolic polymer and an epoxy resin. COPYRIGHT: (C)2007,JPO&INPIT |
