| 摘要 |
PROBLEM TO BE SOLVED: To obtain a process for producing a multilayer printed wiring board for use in various electronic apparatus, communication apparatus, and the like, wherein a wiring pattern exhibits excellent adhesion to a substrate and suitable for formation of fine pattern. SOLUTION: The process for producing a multilayer printed wiring board comprises a step for forming a resin layer on the surface layer of a core substrate on which a first wiring pattern is formed, a step for forming a conductor layer consisting of fine roughened particles of copper and a copper foil layer on the resin layer, a step for forming a via hole extending from the surface of the copper foil layer where the fine roughened particles of copper are formed to the first wiring pattern, a step for removing smear on the bottom of the via hole by desmear processing, a step for soft etching the conductor layer to leave the copper foil layer by 1.0μm or less and the fine roughened particles of copper, and a step for forming an electroless copper plating layer after catalyst is imparted to the surface of the resin layer and the copper foil layer and the via hole after soft etching. COPYRIGHT: (C)2007,JPO&INPIT |
