摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film excellent in heat resistance and mechanical physical properties. SOLUTION: This polyimide film is characterized by having <100 ppm arsenic (As) content and consisting of a polyimide benzoxazole obtained from the condensation of a tetracarboxylic acid anhydride with a diamine having the benzoxazole structure, as a main component. COPYRIGHT: (C)2007,JPO&INPIT
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