| 摘要 |
A semiconductor heat-transfer method includes the steps of (a) treating a high conductivity metal substrate through an electrolytic oxidation process to have an oxidized insulation layer be covered on the surface of the high conductivity metal substrate, (b) covering a metal conducting layer on the oxidized insulation layer at selected locations, and (c) installing an electronic device in the high conductivity metal substrate and bonding lead wires to the electronic device and the metal conducting layer for enabling produced heat to be transferred to the metal substrate for quick dissipation during working of the electronic device.
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