| 摘要 |
A production method for devices includes: a bonding process for placing circuit surfaces of other divided plural semiconductor chips onto circuit surfaces of semiconductor chips of a wafer and bonding the other semiconductor chips to the semiconductor chips of the wafer; and a semiconductor chip grinding process for grinding rear surfaces of the other semiconductor chips by a grinding apparatus while the wafer is held such that the rear surface of the wafer faces a chuck table of the grinding apparatus. The production method further includes a resin filling process for filling a resin on the surface of the wafer so that a surface of the resin corresponds with the rear surfaces of the other semiconductor chips; and a wafer grinding process for grinding the rear surface of the wafer by a grinding apparatus while the wafer is held such that the surface of the wafer on which the resin is filled faces a chuck table of the grinding apparatus. The production method further includes a wafer supporting process for supporting one of the surface and the rear surface of the wafer by a supporting member; and a dividing process for dividing the wafer along predetermined division lines while the wafer is supported by the support member, thereby obtaining devices having the semiconductor chips and the other semiconductor chips bonded on the semiconductor chips.
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