| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce subsequent failure at a low cost based on detection data of failure factor. <P>SOLUTION: A carrier board for holding a flexible substrate is conveyed to a mounting process and an electronic component is mounted thereon. The carrier board is provided with an adhesive material which holds the flexible substrate planarly. After the component is mounted, amount of warpage occurring due to separation of the flexible substrate from the carrier board is measured in a measuring process 13. Subsequently, the measured amount of warpage is compared with a threshold in a judgment process 15 and a judgment is made that the carrier board is disapproved if the measured amount of warpage exceeds the threshold. With regard to a carrier board judged to be disapproved, its identification information is displayed at a display section and subsequent use is forbidden. <P>COPYRIGHT: (C)2007,JPO&INPIT |
