| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame where mechanical strength of an inner lead is kept and a wire sweep does not occur, and to provide the manufacturing method of the lead frame. SOLUTION: At an inner lead tip of the lead frame 200, tips of the inner leads 212 are fixed by resins 220 and 230 arranged in a gap between the inner leads 212 and 212, and a gap between the inner lead 212 and a die pad support bar 216. Resins 220 and 230 are arranged at points 217. A part projects from a wire bonding face of the inner lead 212. Adhesive is injected and resins 220 and 230 are arranged by a dispensing method, a jet dispensing method, an adhesive injection method, a transfer bumping method, a screen printing method, a mask method, and a B stage curing film method. COPYRIGHT: (C)2007,JPO&INPIT
|
