发明名称 SEMICONDUCTOR DEVICE DESIGN SUPPORT METHOD, SEMICONDUCTOR DEVICE DESIGN SUPPORT SYSTEM AND SEMICONDUCTOR DEVICE DESIGN SUPPORT PROGRAM
摘要 PROBLEM TO BE SOLVED: To identify a statistical model related to a failure occurrence mechanism. SOLUTION: A plurality of hypotheses on the failure occurrence mechanism of each failure mode are assumed, and function types of data distribution from a plurality of state variables to a plurality of output variables are assumed on each of the hypotheses in consideration of a predetermined failure physical model corresponding to each failure mode. A probability variable data set on the plurality of state variables, discretized connection probability distribution and a probability variable data set whose probability density is not zero, are computed using a response surface model and Monte Carlo simulation based on CAE analysis result data given beforehand or under expansion of numerical experiment points, and a parameter corresponding to the function type of the assumed data distribution is estimated from an observation data set obtained beforehand or under monitoring on a plurality of input variables and the plurality of output variables, and from the connection probability distribution of the plurality of state variables computed in a second step. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007108843(A) 申请公布日期 2007.04.26
申请号 JP20050296336 申请日期 2005.10.11
申请人 TOSHIBA CORP 发明人 NAKAYOSHI HIDEO;HIROHATA KENJI;AOKI HIDEO
分类号 G06F17/50;H01L23/34 主分类号 G06F17/50
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