| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin which is suitably used as a coating material to coat a circuit surface of electronic materials such as a coating film forming material for a printed wiring board and to obtain a polyimide resin having a low dielectric constant. SOLUTION: (A) The polyimide resin having a repeating unit expressed by formula (1) (wherein, X is represented by a divalent aromatic group selected from the formula group (1)). COPYRIGHT: (C)2007,JPO&INPIT
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