| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor dicing die bond for making contribution to reduction in the manufacturing cost of semiconductor device, which has the original function for dicing die bond, and which does not easily cause transfer deposition of an adhesive agent layer to the dicing frame. SOLUTION: The adhesive tape for semiconductor wafer dicing die bond conducts the dicing by fixing a semiconductor wafer 11, and moreover bonds the diced semiconductor chip to a lead frame 22. This adhesive tape for semiconductor wafer dicing die bond also comprises a base material film 1 and an adhesive bonding agent layer 2 provided on this base material film. The stress of the base material film ranges from 10 to 40 MPa under the elongation of 10%, the breakdown elongation percentage is≥300%, a surface treatment is conducted to raise close contact between the base material film and adhesive agent layer to the surface where the adhesive bonding agent layer is provided, and the adhesive bonding agent layer has a glass transition point of≥-15°C. COPYRIGHT: (C)2007,JPO&INPIT |
