| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device including an interconnect pattern having partially different characteristics on the surface; and to provide a mounting substrate and manufacturing method thereof, a circuit board, and an electronic instrument. SOLUTION: The semiconductor device includes a first plating layer (30) formed on one surface of an interconnect pattern (21), a second plating layer (32) formed in through-holes (28) in the interconnect pattern (21), a semiconductor chip (10) electrically connected to the first plating layer (30), an anisotropic conductive material (34) provided on the first plating layer (30), and a conductive material (36) to be provided on the second plating layer (32). In the device, the first plating layer (30) has appropriate adhesion properties with the anisotropic conductive material (34), and the second plating layer (32) has appropriate bonding properties with the conductive material (36). COPYRIGHT: (C)2007,JPO&INPIT |
