| 摘要 |
PROBLEM TO BE SOLVED: To reduce a manufacturing cost by reducing the number of parts in a reflection type optical sensor. SOLUTION: A main printed-circuit board assembly 40, a subprinted-circuit board assembly 50, and visible light cut filters 80-1 to 80-3 are incorporated in the case main body 12. In the subprinted-circuit board assembly 50, a first infrared ray emitting element 52, a second infrared ray emitting element 53, and a light receiving element 54 are mounted on the front face of a printed-circuit board 51. In the main printed-circuit board assembly 50, a connector 43, a microcomputer chip 45, and a regulator circuit IC 46 or the like are mounted on the printed-circuit board 41. The printed-circuit board 41 and the printed-circuit board 51 are electrically connected. COPYRIGHT: (C)2007,JPO&INPIT |
