| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit inspecting apparatus for surely controlling temperature of the inspecting position to the setting temperature to achieve accurate inspection, even when temperature distribution at the wafer surface is ununiform and chuck temperature is also ununiform. SOLUTION: The integrated circuit inspecting apparatus 1 comprises a stage 2, a heater wire 3, a heater power supply 5, a temperature sensor, a multiplexer 8, a controller 9, and a probe card 11. The controller 9 controls power feeding to the heater wire 3 of the heater power supply 5 in order to control temperature of a chuck surface 2a on the basis of a sensing value of the selected temperature sensor, by moving the stage 2 for the predetermined distance through control of drive of a stage moving unit 4, and by selecting the temperature sensor for obtaining the sensing value from the multiplexer 8. COPYRIGHT: (C)2007,JPO&INPIT
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