| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor test equipment which can remove dust with a wafer being located in a test chamber with no necessity of moving it, and can keep the whole interior portion of the test chamber at a high degree of cleanness. SOLUTION: The semiconductor test equipment 100 includes a stage 17 for holding the wafer W of a test object formed with an integrated circuit, a light source 25 for irradiating light on the surface of the wafer W, and a test probe 29 brought into contact with the surface of the wafer W. The semiconductor test equipment 100 applies and reads signals using the test probe 29 to test the integrated circuit. The semiconductor test equipment is also equipped with at least the test chamber 11 forming a demarcated space 13 for storing the wafer W, and an air blowing means 33 for blowing air nearly parallel to the surface of the wafer W inside the test chamber 11. COPYRIGHT: (C)2007,JPO&INPIT
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