发明名称 |
Electroless plating apparatus and electroless plating method |
摘要 |
An electroless plating apparatus can form a protective film on exposed surfaces of embedded interconnects stably with good selectivity for thereby protecting the interconnects. The electroless plating apparatus includes a magnetic removal portion for magnetically removing small magnetic suspended solids in an electroless plating solution which have not been removed by a filter.
|
申请公布号 |
US2007092658(A1) |
申请公布日期 |
2007.04.26 |
申请号 |
US20060585957 |
申请日期 |
2006.10.25 |
申请人 |
OWATARI AKIRA;SAIJO YASUHIKO;TSUJINO JUNICHIRO |
发明人 |
OWATARI AKIRA;SAIJO YASUHIKO;TSUJINO JUNICHIRO |
分类号 |
B05D3/00;B05C3/00;B05D1/18;B05D3/12 |
主分类号 |
B05D3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|