| 摘要 |
A method of making a semiconductor package ( 10 ) includes placing an integrated circuit (IC) die ( 12 ) on a first side ( 14 ) of a substrate ( 16 ) and electrically connecting the IC die ( 12 ) to the first side ( 14 ) of the substrate ( 16 ). First solder balls ( 22 ) are attached to a second side ( 24 ) of the substrate ( 16 ). An interposer ( 28 ) is attached to the IC die ( 12 ). A molding operation is performed to encapsulate the IC die ( 12 ), the substrate ( 16 ), at least a portion of the interposer ( 28 ) and at least a portion of the first solder balls ( 22 ).
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