MULTILAYER PRINTED WIRING BOARD AND ITS MANUFACTURING METHOD

摘要

Conventionally, in order to join films used as insulating layers of a multilayer circuit board, an adhesive is used, and this adhesive might adversely influence the thinning of the multilayer circuit board. In the invention, double-sided boards using films are bonded through paste connection layers produced by filling through holes formed in prepreg with a conductive paste and by curing the conductive paste, and second wirings are electrically interconnected through the conductive paste in through holes previously formed in the paste connection layers. Thus, a multilayer board can be produced without using any adhesive, and the multilayer circuit board can be thinned as a whole.