| 摘要 |
<p>The disclosure is directed to a laser processing apparatus employing a polygon mirror, capable of processing an object efficiently. The apparatus is comprised of a laser generator for emitting a laserbeam, a polygon mirror rotating at the axis and having a plurality of reflection planes which reflect the laser beam incident thereon from the laser generator, and a lens irradiating the laser beam on an object, e.g., a wafer, that is settled on a stage, after condensing the laser beam reflected from the polygon mirror. In applying the laser beam to the wafer in accordance with a rotation of the polygon mirror, the stage on which the wafer is settled moves to enhance a relative scanning speed of the laser beam, which enables an efficient cutout operation for the wafer. As it uses only the laser -beam to cutout the wafer, there is no need to change any additional devices, which improves a processing speed and cutout efficiency. Further, it is available to control a cutout width and to prevent a recasting effect by which vapors generated from the wafer during the cutout process are deposited on cutout section of the wafer, resulting in accomplishing a wafer cutout process in highly fine and precise dimensions.</p> |
