| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling structure capable of cooling uniformly each film package electric device in a module. <P>SOLUTION: A module 30A and a module 30B are arranged so that the cross-section of a merging path 22 of cooling air formed between the module 30A and the module 30B may be expanded toward discharge port 60. The cooling air is supplied to a gap 21A of the module 30A toward an arrow α direction which is a direction progressing toward the adjoining module 30B, and the cooling air is supplied to a gap of the module 30B toward a β direction in the opposite direction to the α direction, and each cooling air is joined in the confluence path 22, and then discharged to the outside. <P>COPYRIGHT: (C)2007,JPO&INPIT |
