发明名称 POSITIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which is used in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, and which improves development defect performance and mask error factor even in the formation of a fine pattern of &le;100 nm, and a pattern forming method using the same. <P>SOLUTION: The positive photosensitive composition comprises (A) a resin which has a repeating unit having a diamantane structure and decomposes by the action of an acid to increase solubility in an alkali developer, (B) a compound capable of generating a specific organic acid upon irradiation with an actinic ray or radiation and (C) a solvent. The pattern forming method using the same is also provided. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007108581(A) 申请公布日期 2007.04.26
申请号 JP20050301731 申请日期 2005.10.17
申请人 FUJIFILM CORP 发明人 NISHIYAMA FUMIYUKI;KODAMA KUNIHIKO
分类号 G03F7/039;C08F20/10;G03F7/004;H01L21/027 主分类号 G03F7/039
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