发明名称 PHOTOSENSITIVE COMPOSITION, PATTERN FORMING MATERIAL, PHOTOSENSITIVE LAMINATE, PATTERN FORMING APPARATUS AND PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive composition having high sensitivity, excellent resolution and very high temporal stability of sensitivity and capable of efficiently forming patterns such as a wiring pattern and a solder resist pattern with high definition, to provide a pattern forming material and a photosensitive laminate having a photosensitive layer formed of the photosensitive composition, and to provide a pattern forming apparatus and a pattern forming method. <P>SOLUTION: The photosensitive composition contains at least a binder, a polymerizable compound and a photopolymerization initiation compound, wherein the photosensitive composition contains a compound having a di-substituted amino-benzene as a partial structure and an oxime derivative as the photopolymerization initiation compound. There are also provided the pattern forming material and the photosensitive laminate having a photosensitive layer formed of the photosensitive composition, the pattern forming apparatus equipped with the photosensitive laminate and the pattern forming method. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007108628(A) 申请公布日期 2007.04.26
申请号 JP20060006641 申请日期 2006.01.13
申请人 FUJIFILM CORP 发明人 TAKASHIMA MASANOBU;IKEDA TAKAMI
分类号 G03F7/031;C08F290/06;C08F290/12;G03F7/004;G03F7/027;G03F7/033;G03F7/11;H01L21/027;H05K3/00 主分类号 G03F7/031
代理机构 代理人
主权项
地址