| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which is highly reliable by isolating the side surface of an electrode to be embedded from an insulating resin layer and providing connection with a solder on the side surface of the electrode, to provide a semiconductor device employing the wiring board, and to provide a method of manufacturing the same; concerning the wiring board where a semiconductor element is mounted, the semiconductor device where a semiconductor element is mounted to the wiring board, and the method of manufacturing the same, especially a wiring board provided with a thin wiring structure superior in high-speed transmission characteristic and a semiconductor device employing the wiring board. <P>SOLUTION: The wiring board is provided with a first surface and a second surface wherein a first electrode and a second electrode are formed thereon, respectively. It is comprised of at least one or more insulating layers and at least one or more wiring layers, and one or plural semiconductor elements are mounted thereto. In such the wiring board, the second electrode formed on the second surface is buried in the insulating layer, and a surface on the opposite side to a surface exposing over the second surface side of the second electrode is connected to the wiring layer, and a side surface is not partly in contact with the insulating layer. <P>COPYRIGHT: (C)2007,JPO&INPIT |
