| 摘要 |
PROBLEM TO BE SOLVED: To provide a display module in which a driving circuit mounting board connecting a plurality of driving ICs and/or chip electronic parts is made compact without decreasing the yield nor increasing the cost. SOLUTION: The display module is equipped with a plurality of semiconductor devices generating panel driving signals on the basis of external signals, a driving circuit mounting board where at least one of the above semiconductor devices is flip-chip connected, and a display panel where the panel driving signals generated by the semiconductor devices are input. The driving circuit mounting board includes an electrode connected to the semiconductor device, first wiring connected to the above electrode and at least partially formed inside a first region opposing to the semiconductor device, a second region opposing to the first region across the driving circuit mounting board, second wiring at least partially formed inside the second region, and inner wiring connecting the first wiring and the second wiring. COPYRIGHT: (C)2007,JPO&INPIT |
