| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin sheet which is used for protecting the back sides of semiconductor elements, can be adhered to the back sides of the semiconductors or wafers, and little warps the semiconductors or the wafers, also after the resin is cured. SOLUTION: The thermosetting resin sheet used for protecting the semiconductors is characterized by containing an epoxy resin having divinyl ether or the divinyl ether of an oxyalkylene compound in the molecule and having two or more glycidyl groups in the molecule. COPYRIGHT: (C)2007,JPO&INPIT |
