| 摘要 |
PROBLEM TO BE SOLVED: To provide an oscillator chip and a detection sensor in which losses due to characteristics of structural materials hardly occur. SOLUTION: An SOI substrate is used to form a structural/wiring layer and an oscillator 20 to be formed in a surface of the SOI substrate by a high-concentration Si layer 72 of the SOI substrate. An electrically conductive layer 73 made of metal is formed on the high-concentration Si layer 72. A wiring conductor 57 forming signal wires connecting a detection electrode 30a and a drive electrode 40a to input/output electrodes 30c and 40c and a grounding conductor are formed in the electrically conductive layer 73. By such a wiring structure, it is possible to eliminate the presence of a layer having a prescribed resistivity between the wiring conductor 57 and the grounding conductor, reduce increases in loss due to the signal wiring even in a high-frequency region, substantially reduce parasitic coupling capacitance formed between signal input and output, and acquire an oscillator chip 100B having a high-performance planar-machine-type oscillator 20. COPYRIGHT: (C)2009,JPO&INPIT
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