发明名称 VACUUM FILM FORMATION APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a vacuum evaporation apparatus, in which the degree of freedom of design of film thickness is high, the fine adjustment of film thickness is facile, and the enclosability of moving members for film thickness design is high. SOLUTION: A vacuum film formation apparatus is composed of a vacuum tank and a substrate holding means and an evaporation source contained therein and further provided with at least one shield member which forms an evaporation source shield region on the film formation surface of a substrate, a drive source for the shield member, and a control unit for the drive source, wherein the control unit comprises a storage means which previously stores the measured or calculated value of the in-plane film thickness distribution of a substrate in a state that the shield member does not form a shield region and the set point of the in-plane film thickness distribution of the substrate and an arithmetic means which calculates film formation times corresponding to the respective positions on the substrate according to the values inputted into the storage means and determines the manipulated variables to the drive source according to the film formation times, and the drive source shifts the shield region according to the manipulated variables so as to obtain a desired in-plane film thickness distribution. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007107071(A) 申请公布日期 2007.04.26
申请号 JP20050301195 申请日期 2005.10.17
申请人 SHOWA SHINKU:KK 发明人 USUI RYUICHIRO;HIRANO TOMOJI
分类号 C23C14/54 主分类号 C23C14/54
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