| 摘要 |
PROBLEM TO BE SOLVED: To provide copper or copper alloy foil capable of obtaining a smooth surface when being subjected to half etching. SOLUTION: In the copper or copper alloy foil for a circuit, when the cross-section orthogonal to the sheet thickness direction is observed, the area ratio of crystal grains in which the angle formed by the [100] orientation of the crystal grains and the rolling direction is≤15 degrees is≥80%, and also, the maximum crystal grain size is≤5μm. COPYRIGHT: (C)2007,JPO&INPIT
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