| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor, which has excellent adhesiveness to a lead frame, especially a lead frame plated with nickel/palladium/gold (Ni/Pd/Au) and excellent solder resistance. SOLUTION: The epoxy resin composition for sealing a semiconductor comprises (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) sulfur in a content of 0.01-1.0 wt.% based on the total of the epoxy resin composition. COPYRIGHT: (C)2007,JPO&INPIT
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