| 发明名称 |
NON-PLASMA METHOD OF REMOVING PHOTORESIST FROM A SUBSTRATE |
| 摘要 |
<p>A method is provided to remove in particular ion implanted photoresist from a substrate, such as a semiconductor wafer, consisting of heateing the photoresist for deforming an interface of a crust and bulk layer of the photoresist, and controlling a temperature of the heating for cracking the photoresist</p> |
| 申请公布号 |
WO2007046835(A1) |
申请公布日期 |
2007.04.26 |
| 申请号 |
WO2005US47106 |
申请日期 |
2005.12.28 |
| 申请人 |
BOC, INC.;THE ARIZONA BOARD OF REGENTS ON BEHALF OF THE UNIVERSITY OF ARIZONA |
发明人 |
BANERJEE, SOUVIK;BORADE, RAMESH, B.;CROSS, PEGGI;RAGHAVAN, SRINI |
| 分类号 |
C03C23/00;B08B3/00;B08B7/00;B08B7/04;C23D17/00;C23G1/00;C23G1/02 |
主分类号 |
C03C23/00 |
| 代理机构 |
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