发明名称 SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC INFORMATION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To reduce white flaw on a displayed image by suppressing a failure of a photosensitive area of a solid-state imaging device. <P>SOLUTION: In the solid-stage imaging device, an n-type impurity diffusing region is formed within the p-type region on a semiconductor substrate, and a photodiode area (photosensitive area) is formed with pn junction between the p-type region and n-type impurity diffusing region, arsenic (As) having the radius of atom similar to that of silicon (Si) is used in the shallow area near the front surface of substrate, and phosphorus (P) equivalent in mass to silicon (Si) is used in the deep area at the time of ion implantation of the n-type impurity diffusing region 3A forming the photodiode area 4 as the photosensitive area. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007109818(A) 申请公布日期 2007.04.26
申请号 JP20050298039 申请日期 2005.10.12
申请人 SHARP CORP 发明人 TOKUMITSU CHIE
分类号 H01L27/148;H01L27/146;H01L31/10 主分类号 H01L27/148
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